ENGITEX 13
less is more !
The Engineering Technology Exhibition or ENGITEX is a programme organized by the Engineering Student’s Society of the International Islamic University Malaysia (IIUM). The first ENGITEX was held in August 1999 and as yet may be the first Science and Technology related event that was held in auspicious new home in Gombak.
ENGITEX became a platform on which IIUM engineering students were able to contribute to the society. Participants from both IIUM and the public at large, including organizers had the opportunity to gather and discuss matters, debate and listen to distinguished speakers in talks pertaining technology developments and students.
ENGITEX 2013 (ENGITEX ‘13) will carry forward the previous ENGITEX’s evolution, which core contemporary issues as the main concern of the organization, in which the future aspects of the world of engineering will be looked into and scrutinized by participants from within IIUM and outside the IIUM community.
“Less is More” has been chosen as the theme for ENGITEX `13. As we all can see, the world is suffering from constant pollution and corruption. Sadly, one of the contributors to these damages is an engineer. The future engineers need to be aware of this situation. So, we were called to emphasize on the environmental issue in this ENGITEX as our target groups consist of students from universities, high schools and primary schools specifically and the public generally. In this context, “Less is More” means to reduce using or producing anything that may harm the environment and these actions will bring forth more benefits to us in the long run.
One of the learning outcomes of the programme conducted by the Kulliyyah is for the students to have the ability to understand the responsibility of a professional
engineer in the context of contemporary social, cultural, global and environmental issues. Taking this outcome into account, we constructed this programme so that the
target groups can know the responsibilities of an engineer in conserving the earth.
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